Feature

  • PTCXPUMP High Pressure Pumps are also commonly referred to in the industry as dual-shaft pumps, dual-output shaft high-pressure pumps, dual-bearing high-pressure pumps, or twin-screw high-pressure pumps.
  • Powered by compressed air, this pumping device pressurizes and discharges liquids through two synchronized or alternating shafts (plungers). It elevates low-pressure fluids to extremely high pressures, enabling atomization or precise-metering spraying through specialized nozzles.
  • The core of the dual-shaft pneumatic high-pressure pump lies in its advanced "dual-reciprocating motion" mechanism.
  • Delivers exceptional pressure output stability. While single-shaft pumps generate noticeable pressure pulsations during stroke reversals, the dual-shaft design utilizes an alternating pressure-compensation mechanism to provide a near-linear, stable output—which is absolutely critical for enhancing wafer cleaning uniformity.
  • Engineered with a critical fail-safe design logic; even if one set of seals experiences minor
  • wear or leakage, the other shaft can maintain baseline pressure. This prevents immediate production line shutdowns and wins crucial buffer time for scheduled maintenance.
  • Operating entirely without electrical power, it achieves intrinsic safety and can be installed directly in chemical storage tank areas or flammable gas environments, eliminating the need for expensive explosion-proof enclosures.
  • The dual-shaft structure effectively shares the reciprocating frequency of a single shaft, slowing down the wear rate of the seals and significantly extending the Mean Time Between Failures (MTBF). This offers immense market appeal for factories striving for 24/7 continuous operations.

Inquiry
  • Feature
  • Application
  • Industries
  • Maximum Discharge Pressure: 2,400 PSI (34:1 Pressure Ratio) / 3,500 PSI (50:1 Pressure Ratio).
  • Highly Stable Pressure Output: Fluctuations and pulsation rates are kept strictly below 5%.
  • High Cleanliness Standards: Guarantees zero oil residue and exceptionally low particle leaching/extraction.
  • Pneumatic Design: Driven by compressed air to pressurize cleaning liquids (e.g., Ultra-Pure Water, photoresist), offering superior explosion-proof safety.
  • Purely Air-Driven Core: Requires no electrical power supply, completely eliminating the risk of explosions triggered by electrical sparks or arcing from the root.
  • Consistent & Stable Pressure Output: Driven by an internal pneumatic distribution valve, the dual shafts alternate operations to effectively suppress fluid pulsation, ensuring a stable flow rate throughout the pressurization process.
  • Dual-Defensive Mechanism: Features a dual-set seal design; even if one set experiences minor wear, the redundancy backup mechanism immediately takes over to ensure continuous production line operation.
  • Low Maintenance Costs: The dual-shaft structure effectively shares the reciprocating frequency of a single shaft, slowing down seal wear and significantly extending the Mean Time Between Failures (MTBF).
  • Horizontal Configuration & Easy Installation: Adopts a horizontal setup for effortless installation and direct piping, drastically minimizing the risk of fluid leakage at joint threads.
  • Check Valve Seal Structure: Constructed from high-grade fluoropolymer (PTFE).

Engineered for Rigorous Environments Demanding "High-Pressure Stable Output" and "Strict Safety Standards": PTCXPUMP High-Pressure Pumps Are Highly Recommended

 

Semiconductor Front-End Processes (Single-Wafer & Photolithography Cleaning)

Specifically engineered for single-wafer processing and photolithography cleaning systems, satisfying the most stringent contamination requirements for microparticles on wafer surfaces. Leveraging a sub-5% stable output pressure fluctuation and a high-cleanliness structure, it delivers precise and consistent chemical delivery to reliably remove surface contaminants from silicon wafers—serving as a critical key to boosting yields in fine-patterning geometries.

Etch & Advanced Packaging Clean (Etching & Bumping Processes)

Demonstrates superior fluid control in etching post-clean and bumping processes. Whether handling highly corrosive etching chemistries or aggressive organic solvents required prior to bumping sputtering (such as acetone and isopropyl alcohol/IPA), the dual-shaft redundancy mechanism ensures uninterrupted, stable pressurized output under high-intensity ultrasonic and specialized cleaning environments.

Fine Chemicals & Chemical Delivery Systems (Fine Chemicals & CDS)

Featuring excellent pneumatic explosion-proof safety, this pump is the ideal choice for chemical delivery systems (CDS) and circulation loops involving high-purity, electronic-grade chemicals, strong acids, and strong bases. Within hazardous explosion-proof zones where the risk of electrical sparks is completely eliminated, it safely and seamlessly pressurizes high-risk fluids while ensuring absolute production-line safety.

Industrial Cleaning & Surface Treatment (Precision Component & Panel Cleaning)

Tailored for high-end industrial sectors, precision components, or optoelectronic panel surface-cleaning needs, providing a powerful high-pressure output of up to 3,500 PSI. The combination of high-cleanliness control (zero oil residue, low particle leaching) and the extended Mean Time Between Failures (MTBF) of the dual-shaft architecture enables efficient stripping of stubborn contaminants in continuous automated cleaning lines without damaging the workpiece surface.



  • Semiconductor & Optoelectronics
  • Wafer Wet Cleaning
  • Single Wafer & Photo Clean
  • Stripping & Etching Clean
  • Advanced Packaging Bumping Clean
  • Fine Chemicals & CDS
  • Chemical Delivery System Dispensing
  • Pressurizing Corrosive Fluids
  • Fluid Transfer in Explosion-Proof Zones
  • Energy & Power Systems
  • Fuel Cell Humidification
  • Continuous Chemical Feeding
  • Boiler Water Treatment
  • Industrial Cleaning & Surface Treatment
  • Precision Parts & Panel Degreasing
  • PCB & Equipment High-Pressure Rinsing